CoAsia Nexell

Overview.

Custom ASIC Solution

CoAsia Nexell delivers optimized Custom ASIC solutions leveraging our extensive experience in multimedia, automotive cockpit, and vision domains. Combining our ASIC expertise with the 3D packaging capabilities of our parent company, CoAsia SEMI, we introduced the 3D Stacked ASIC Solution.
Rather than simple die stacking, this solution co-optimizes logic, custom memory, packaging, and overall system architecture for next-generation data-intensive applications. It overcomes the inherent limitations of conventional logic-memory decoupled structures in memory bandwidth, latency, power efficiency, and form factor. In 2026, we demonstrated this capability by successfully developing a Cloud Gaming ASIC as our first commercial implementation.

Solution.

3D Stacked ASIC Solution

Application: Cloud Gaming

This Cloud Gaming ASIC features high-density video processing units, die/chip inter-connections, and an embedded management subsystem. Utilizing Wafer-on-Wafer (WoW) 3D stacking, it vertically integrates the Logic and DRAM Dies. This packaging architecture delivers high-bandwidth, low-latency on-package memory access without external accelerators, creating a tightly coupled compute–memory hierarchy optimized for real-time video processing.

Key Features

- 1 Logic Die + 4 Custom DRAM WoW Stacking
- Process Node (Logic Die): SAMSUNG 8㎚
- PKG Size: 55㎜ x 55㎜
- TDP: 200W per Die
- Core Voltage: 0.75V

Product

Overview.

Solution.